PI: Jianxing Sun
Co-PI: Carlos Romero
University: Lehigh University
Industry partner: Advanced Cooling Technologies, Inc.
As AI-driven workloads push data center rack power densities beyond 100 kW, traditional air cooling is becoming obsolete. Immersion cooling—submerging electronics in dielectric fluids—offers a superior, energy-efficient alternative. However, the adoption of this technology is currently limited by the low thermal conductivity of available dielectric fluids (e.g., hydrofluoroketones), which is nearly an order of magnitude lower than water. While nanofluids can enhance thermal transport, maintaining long-term dispersion stability remains a critical industry-wide hurdle. Formulating stable fluorine-based nanofluids is uniquely challenging due to their low surface energy, low dielectric constants, and lack of electrostatic stabilization. Conventional stabilizing methods used in water or oil systems are largely ineffective in these environments, especially under the rigorous boiling and thermal cycling conditions required for high-density computing. This 12-month project, a partnership between Lehigh University and Advanced Cooling Technologies (ACT), addresses these barriers through a novel surface engineering approach. By chemically grafting compatible polymer chains onto ceramic nanoparticles, we will introduce steric repulsion to suppress aggregation and sedimentation. This study will systematically evaluate nanofluid stability, thermophysical properties, and heat-transfer performance in both single-phase and two-phase (boiling) regimes. Supported by PITA funding and ACT’s industrial expertise, this research provides the foundational data necessary to transition laboratory innovations into scalable, high-performance immersion cooling solutions for next-generation AI infrastructure. The project also supports Pennsylvania’s leadership in the data center industry by advancing cutting-edge technology and fostering workforce development in high-performance computing thermal management.